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Delphine 5504 Delphine 5504 INTERFLUX® Delphine 5504 solder paste for lead free alloys is specially developed to give extremely low voiding with bga and conventional joints. Delphine 5504 is a no-clean, halide free solder paste with long tack and stencil life. Its wide process window and abandon time make it the first choice in lead free reflow in both air and nitrogen. It leaves minimal, pin testable residue.• arrow Extremely low voiding• arrow No-clean, halide free• arrow Pin testable• arrow Long tack and stencil life• arrow Minimal and clear residuEmail kami untuk mendapatkan Data MSDS dan TDS mengenai produk yang anda kunjungi. Share To :
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