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IF 2005C No-Clean flux IF 2005C No-Clean flux INTERFLUX® IF 2005C has been developed for lead free selective soldering. It is the preferred flux of many for selective soldering processes. It is based on the highly successful IF 2005M and like the latter, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. With no rosin or resin to create a sticky residue, there are no contact problems, caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements and is QPL-listed. It provides great solderablility on HAL, NiAU and OSP-coated PCB"s. Email kami untuk mendapatkan Data MSDS dan TDS mengenai produk yang anda kunjungi. Share To :
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