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IF 2005M No-Residue™ flux IF 2005M No-Residue™ flux INTERFLUX® IF 2005M is a low solids no-clean flux, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. With no rosin or resin to create a sticky residue, there are no contact problems caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements and is QPL-listed. It provides great solderability on HAL, NiAU and OSP-coated PCB"s.IF 2005M also provides excellent solderability on lead free alloys. It has a longer life in the foam fluxer compared to synthetic fluxes, making it the most cost-effective choice for no clean soldering.Email kami untuk mendapatkan Data MSDS dan TDS mengenai produk yang anda kunjungi. Share To :
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