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PacIFic 2009M No-CleanPacIFic 2009M No-Clean, VOC free flux INTERFLUX® IF 2009M is a low solids VOC free, no-clean flux, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. With no rosin or resin to create a sticky residue, there are no contact problems, caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements. It provides great solderability on HAL, NiAU and OSP-coated PCB"s.IF2009M also provides excellent solderability on lead free alloys. Email kami untuk mendapatkan Data MSDS dan TDS mengenai produk yang anda kunjungi. Share To :
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